AI-powered 3D terahertz Fourier imaging for fast, non-ionising, non-destructive industrial inspection — no mechanical scanning required.
Industries need to inspect multilayer, non-conductive materials safely and quickly. Current solutions each compromise on safety, speed, depth, or resolution.
Ionising radiation demands shielding, licensing, and provides poor contrast for low-density plastics, polymers, and paper materials.
Safe but limited: long wavelengths constrain spatial resolution, making fine defect detection in thin films or laminates impractical.
Achieve surface-level resolution only. Strongly attenuated by plastics and coatings — invisible to subsurface defects.
Promising wavelength, but existing systems rely on slow point-by-point raster scanning — incompatible with production line speeds.
A compact, solid-state dual-band THz transceiver combined with physics-informed AI to produce depth-resolved images without mechanical scanning.
Coherent amplitude + phase measurement enables numerical reconstruction at any depth from a single acquisition — no mechanical z-scanning needed.
100–110 GHz for deep penetration, 200–220 GHz for fine resolution. Shared local oscillator keeps the system compact and phase-locked.
Physics-informed neural networks reconstruct defect maps from <5% of Fourier samples, converting complex 3D imaging into real-time binary decisions.
Monolithic <30 × 30 cm enclosure with automated calibration, autofocus, and one-click operation — designed for non-expert operators.
Validated in two high-impact pilot scenarios with clear ROI paths.
Non-contact, depth-resolved detection of delamination, voids, wrinkles, and adhesive failures in glass-fibre and carbon-fibre composites — without ionising radiation.
See through sealed multi-layer packaging to verify internal completeness, structural alignment, and sealing integrity — enabling end-of-line inspection and counterfeit prevention.
The only non-ionising, volumetric 3D imaging system designed for inline industrial environments — without mechanical scanning.
| Feature | HyperTHz | THz TDS | X-Ray / CT | mm-Wave | Ultrasound | IR Thermo. |
|---|---|---|---|---|---|---|
| Non-Ionising | ✓ | ✓ | ✗ | ✓ | ✓ | ✓ |
| Volumetric 3D (no z-scan) | ✓ | Partial | ✓ (CT) | Partial | Partial | ✗ |
| Lateral Resolution | 0.3–1 mm | 0.3–1 mm | 5–100 µm | 1–5 mm | 0.2–1 mm | 0.2–1 mm |
| Inline Throughput | High | Low–Med | Medium | High | Medium | High |
| Compliance Burden | Low | Low | High | Low | Medium | Low |
| Moisture/Water Contrast | High | High | Low | Medium | Med–High | Low–Med |
Whether you inspect composites, packaging, or other multilayer materials — let us explore how THz imaging can transform your quality control.